ISCA '97 Attendee List
Abdel-Shafi Hazim Abdel-Shafi Rice University shafi@rice.edu
Adve Sarita Adve Rice University sarita@rice.edu
Agarwal Anant Agarwal M.I.T. agarwal@lcs.mit.edu
Akella Janaki Akella HP janaki@cup.hp.com
Albonesi David Albonesi University of Rochester albonesi@ee.rochester.edu
Altman Erik Altman IBM T.J. Watson Research Cntr erik@watson.ibm.com
Alvarez Guillermo Alvarez Univ. of California-San Diego galvarez@cs.ucsd.edu
Amorim Claudio Amorim COPPE/UFRJ amorim@cos.ufrj.br
Anderson Thomas Anderson University of California - Berkeley tea@cs.berkeley.edu
Ansari Ahmad Ansari IBM Microelectronics ansari@btv.ibm.com
Arramreddy Venkat Arramreddy Intel Corporation varram@ichips.intel.com
Austin Todd Austin Intel Corp, MRL taustin@ichips.intel.com
Ayguade Eduard Ayguade Universitat Politecnica de Catalunya eduard@ac.upc.es
Babb Jonathan Babb MIT jbabb@mit.edu
Baer Jean-Loup Baer University of Washington baer@cs.washington.edu
Bagherzadeh Nader Bagherzadeh University of California, Irvine nader@ece.uci.edu
Bahar Iris Bahar Brown University iris@lems.brown.edu
Banerjee Chandramouli Banerjee SUN Microsystems chandra.banerjee@eng.sun.com
Barroso Luiz Andre Barroso DIGITAL Western Research Lab barroso@pa.dec.com
Barua Rajeev Barua M.I.T. barua@lcs.mit.edu
Baskett Forest Baskett Silicon Graphics Inc. baskett@sgi.com
Bassetti Federico Bassetti Los Alamos National Laboratory fede@acl.lanl.gov
Beaty Steve Beaty Hewlett-Packard steve_beaty@hp.com
Beivide Ramon Beivide Universidad de Cantabria. SPAIN mon@atc.unican.es
Berenbaum Alan Berenbaum Bell Labs, Lucent Technologies adb@bell-labs.com
Bezenek Todd M. Bezenek University of Wisconsin bezenek@cs.wisc.edu
Bhatt Ajay Bhatt Intel avbhatt@ichips.intel.com
Black Bryan Black Carnegie Mellon black@ece.cmu.edu
Blumrich Matt Blumrich Princeton mb@cs.princeton.edu
Bockhaus John Bockhaus Hewlett-Packard Co. jwb@fc.hp.com
Bondi Jim Bondi Texas Instruments bondi@ti.com
Boppana Rajendra Boppana UT San Antonio boppana@cs.utsa.edu
Bordawekar Rajesh Bordawekar California Institute of Technology rajesh@cacr.caltech.edu
Bose Pradip Bose IBM Corporation bose@watson.ibm.com
Boyd Todd Boyd IBM wtboyd@vnet.ibm.com
Breach Scott Breach University of Wisconsin - Madison breach@cs.wisc.edu
Briscoe Michael Briscoe DOD
Brockman Jay Brockman University of Notre Dame jbb@cse.nd.edu
Brown Aaron Brown Harvard University abrown@eecs.harvard.edu
Burger Doug Burger University of Wisconsin-Madison dburger@cs.wisc.edu
Calder Brad Calder University of California, San Diego calder@cs.ucsd.edu
Cardwell Neal Cardwell University of California-Berkeley neal@cs.berkeley.edu
Carl Richard Carl University of Wisconsin - Madison rcarl@cs.wisc.edu
Carlson Michael Carlson Silicon Graphics, Inc. mdc@sgi.com
Carmean Doug Carmean Intel dcarmean@ichips.intel.com
Carter Nicholas Carter MIT AI Lab npcarter@ai.mit.edu
Chaiken Ronnie Chaiken Microsoft rchaiken@microsoft.com
Chang Chuan-hua Chang Digital Semiconductor chang@segsrv.enet.dec.com
Chang Po-Yung Chang University of Michigan pychang@umich.edu
Chapin John Chapin MIT jchapin@lcs.mit.edu
Chappell Robert Chappell University of Michigan robc@eecs.umich.edu
Charney Mark Charney IBM Watson Research Center charney@watson.ibm.com
Chen Chien Chen Hal Computer Systems chen@hal.com
Chen Peter Chen University of Michigan pmchen@eeks.umich.edu
Chen William Chen Intel wychen@gomez.sc.intel.com
Chervenak Ann Chervenak Georgia Tech annc@cc.gatech.edu
Choi Yunho Choi samsung electronics.co yhchoi@khpost.semi.samsung.com
Chong Fred Chong University of California at Davis chong@cs.ucdavis.edu
Choudhary Alok Choudhary Northwestern University choudhar@ece.nwu.edu
Chow Paul Chow University of Toronto pc@eecg.toronto.edu
Christensen Kathryn Christensen Naval Postgraduate School katelll@ix.netcom.com
Clapp Russell Clapp Sequent Computer Systems rmc@sequent.com
Colarelli Dennis Colarelli NCAR djc@ncar.ucar.edu
Colwell Bob Colwell Intel Corp. bcolwell@ichips.intel.com
Commander Darrell Commander Compaq Computer Corporation darrellc@bangate.compaq.com
Conte Tom Conte NC State University conte@eos.ncsu.edu
Corwin Susan Corwin Intel corwin@ichips.intel.com
Dally William Dally MIT AI Lab billd@ai.mit.edu
Daoud Zeina Daoud Intel Corporation zdaoud@mipos2.intel.com
Davis Mark Davis University of Michigan / Intel Corporation mdavis@engin.umich.edu
De Gloria Alessandro De Gloria Univ. of Genoa -DIBE adgodibe.unige.it
Delica Thomas Delica Siemens Nixdorf thomas.delica@mch.sni.de
Dennis John Dennis University of Colorado at Boulder dennis@ncar.ucar.edu
Dennison Charles Dennison Micron Technology cdennison@micron.com
Despain Alvin Despain USC despain@isi.edu
Devabhaktuni Srikrishna Devabhaktuni M.I.T. chinnama@lcs.mit.edu
Downer Wayne Downer Sequent Computer Systems wayned@sequent.com
Dubey Pradeep Dubey IBM, T.J. Watson Research Center pradeep@watson.ibm.com
Dwarkadas Sandhya Dwarkadas University of Rochester sandhya@cs.rochester.edu
Dwyer Harry Dwyer Bell Labs - Lucent Technologies dwyer@bell-labs.research.com
Ebcioglu Kemal Ebcioglu IBM Watson Research Cntr kemal@watson.ibm.com
Eckert Zulah Eckert Hewlett-Packard Company zulah@fc.hp.com
Edmondson John H. Edmondson Digital Equipment Corp. jhe@segsrv.enet.dec.com
Edwards Bruce Edwards Digital Semiconductor edwards@rock.enet.dec.com
Eggers Susan Eggers University of Washington eggers@cs.washington.edu
Elliott Duncan Elliott University of Alberta duncan.elliott@ualberta.ca
Emberson David Emberson Sun Microsystems dre@sun.co
Emer Joel Emer Digital Equipment Corporation emer@vssad.hlo.dec.com
Ertekin Oguz Ertekin Hewlett-Packard Company oe@fc.hp.com
Faanes Greg Faanes Cray Research/SGI
Fagin Barry Fagin US Air Force Academy fagin@cs.usafa.af.mil
Falsafi Babak Falsafi University of Wisconsin -- Madison babak@cs.wisc.edu
Farkas Keith Farkas Digital Equipment Corporation farkas@pa.dec.com
Fetterman Michael Fetterman Intel Corporation mafetter@ichips.intel.com
Fillo Marco Fillo Digital Equipment Co. fillo@eng.pko.dec.com
Flautner Krisztian Flautner ACAL / University of Michigan manowar@engin.umich.edu
Fortes Jose Fortes Purdue University fortes@purdue.edu
Frank Matthew Frank M.I.T. mfrank@lcs.mit.edu
Freudenberger Stefan Freudenberger Hewlett-Packard Laboratories Freudenberger@hpl.hp.com
Freudenthal Eric Freudenthal New York University freudenthal@nyu.edu
Friendly Daniel Friendly University of Michigan ites@eecs.umich.edu
Fromm Rich Fromm University of California, Berkeley rfromm@cs.berkeley.edu
Ganger Greg Ganger MIT ganger@lcs.mit.edu
Gao Guang Gao University of Delaware ggao@cs.mcgill.ca
Gearty Margaret Gearty SGS-Thomson Microelectronics Ltd margaret@bristol.st.com
Gehringer Edward Gehringer North Carolina State University efg@ncsu.edu
Gharachorloo Kourosh Gharachorloo Digital Equipment Corporation kourosh@pa.dec.com
Giacalone Glenn Giacalone Digital Equipment Corp. gpg@choosy.blo.dec.com
Gimarc Charles Gimarc Symbios Logic, Inc. charles.gimarc@symbios.com
Golbus Jason Golbus University of California, Berkeley jgolbus@cs.berkeley.edu
Gold Stephen Gold HAL Computer Systems goldschm@hal.com
Goodman James Goodman University of Wisconsin-Madison goodman@cs.wisc.edu
Gopal Sridhar Gopal University of Wisconsin-Madison gsri@cs.wisc.edu
Gornish Edward Gornish Hewlett-Packard egornish@cup.hp.com
Gottlieb Allan Gottlieb NYU and NEC Research gottlieb@nyu.edu
Green Tom Green Advanced Micro Devices tom.green@amd.com
Gribstad Ben Gribstad University of California, Berkeley gribstad@cory.eecs.berkeley.edu
Gunter Michial Gunter MIPS Group, Silicon Graphics gunter@sgi.com
Gupta Ram Gupta Cray Research/SGI rgupta@cray.com
Hagersten Erik Hagersten Sun Microsystems erikh@eng.sun.com
Hakura Ziyad Hakura Stanford University zsh@powderkeg.stanford.edu
Hammami Omar Hammami University of Aizu hammami@u-aizu.ac.jp
Hammond Lance Hammond Stanford University lance@leland.stanford.edu
Hardavellas Nikolaos Hardavellas University of Rochester nikolaos@cs.rochester.edu
Hargis Jeff Hargis Hewlett Packard hargis@fc.hp.com
Heinlein John Heinlein Stanford University heinlein@cuervo.stanford.edu
Hennessy John Hennessy Stanford University jlh@vsop.stanford.edu
Henning John Henning Digital Equipment Corporation henning@zko.dec.com
Hilgendorf Rolf Hilgendorf IBM Germany rhilgendorf@vnet.ibm.com
Hill Mark Hill University of Wisconsin - Madison markhill@cs.wisc.edu
Hingarh Hemraj Hingarh Sun Microsystems karyn.marxmiller@eng.sun.com
Holmberg Per Holmberg Ericsson per.holmberg@uab.ericsson.se
Hsu Wei-Chung Hsu Hewlett Packard Company wei@cup.hp.com
Hsu Windsor Hsu University of California Berkeley windsorh@csberkeley.edu
Hwang Hoyoung Hwang Seoul National University hyhwang@archi.snu.ac.kr
Hwu Wen-mei Hwu University of Illinois hwu@crhc.uiuc.edu
Ignatowski Michael Ignatowski IBM mignatowski@vnet.ibm.com
Iwata Ejii Iwata Stanford University iwata@uru.stanford.edu
Jackson Kathryn Jackson IBM jackson@vnet.ibm.com
Jacob Bruce Jacob University of Michigan blj@eecs.umich.edu
Jamil Sujat Jamil Intel Corporation sjamil@sedona.intel.com
Jiang Daniel Jiang M.I.T. xjiang@lcs.mit.edu
Johnson Teresa Johnson University of Illinois at Urbana/Champaign tjohnson@crhc.uiuc.edu
Joo Yangsung Joo LG Semicon Co., Ltd. jooys@lgsemicon.co.kr
Jordan Harry Jordan University of Colorado - Boulder harry@colorado.edu
Joseph Doug Joseph IBM / University of Colorado djoseph@watson.ibm.com
Joshi Amod Joshi Intel Corporation amjoshi@ichips.intel.com
Jouppi Norman Jouppi DEC Western Research Lab jouppi@pa.dec.com
Kagi Alain Kagi UW Madison; Computer Sciences Dept. alain@cs.wisc.edu
Kamannavar Anand Kamannavar University of Wisconsin - Madison anand@ece.wisc.edu
Kaxiras Stefanos Kaxiras University of Wisconsin-Madison kaxiras@cs.wisc.edu
Keckler Steve Keckler MIT skeckler@ai.mit.edu
Keeton Kim Keeton University of California, Berkeley kkeeton@cs.berkeley.edu
Keltcher Paul Keltcher Hewlett Packard keltcher@cdc.hp.com
Kim Jae Kim HAL Computer Systems jkim@hal.com
Kim Lee-Sup Kim KAIST eskim@eekaist.kaist.ac.kr
Kissell Kevin Kissell Silicon Graphics kevink@acm.org
Kling Ralph Kling Intel Corp. rkling@mipos2.intel.com
Knies Allan Knies Intel Corporation aknies@mipos2.intel.com
Kobayashi Satoru Kobayashi NEC Corporation FWT34641@biglobe.ne.jp
Kontothanassis Leonidas Kontothanassis DEC-CRL kthanasi@crl.dec.com
Koppelman David Koppelman Louisiana State University ECE Dept koppel@ee.lsu.edu
Koren Yuval Koren Silicon Graphics, Inc. yuval@sgi.com
Koudriavtsev Alexei Koudriavtsev University of Notre Dame akoudria@cse.nd.edu
Koufaty David Koufaty University of Illinois koufaty@cs.uiuc.edu
Kozyrakis Christoforos Kozyrakis University of California, Berkeley kozyraki@cs.berkeley.edu
Kremer Ulrich Kremer Rutgers University uli@cs.rutgers.edu
Krick Bob Krick Intel rfk@ichips.intel.com
Krishnan Venkata Krishnan University of Illinois venkat@cs.uiuc.edu
Kubiatowicz John Kubiatowicz M.I.T. kubitron@lcs.mit.edu
Kudoh Tomohiro Kudoh Real World Computing Partnership kudoh@trc.rwcp.or.jp
Kumar Ashok Kumar Hewlett-Packard Company ashok@cup.hp.com
Kundu Partha Kundu Digital Equipment Corp. kundu@segsrv.engt.dec.com
Kuo Chen-Chi Kuo University of Utah
Kurdahi Fadi Kurdahi University of California at Irvine kurdahi@uci.edu
Kuskin Jeffrey Kuskin Stanford University jsk@havoc.stanford.edu
Lai Konrad Lai Intel lai@ichips.intel.com
Lal Manoj Lal Intel Corp. mlal@ichips.intel.com
Lalwani Ajay Lalwani Samsung alalwani@ssi.samsung.com
Landers Robert Landers Texas Instruments landers@ti.com
Le Jennifer Le Motorola jle@seasick.sps.mot.com
Lebeck Alvin Lebeck Duke University alvy@cs.duke.edu
Lee Corinna Lee University of Toronto corinna@eecg.toronto.edu
Lee Dennis Lee University of Washington dlee@cs.washington.edu
Lee Joonwon Lee KAIST joon@cs.kaist.ac.kr
Lee Minsuk Lee Hansung Univ. mslee@spacr.snu.ac.kr
Lee Moon-Key Lee Yon Sei University visprof@uivlsisu.csl.uiuc.edu
Lee Walter Lee M.I.T. walt@lcs.mit.edu
Lefurgy Charles Lefurgy University of Michigan lefurgy@umich.edu
Lehmann John Lehmann National Science Foundation jlehmann@nsf.gov
Lenoski Dan Lenoski Silicon Graphics lenoski@sgi.com
Lim Beng-Hong Lim IBM Corporation bhlim@watson.ibm.com
Lindsay Don Lindsay CU-Boulder lindsay@cs.colorado.edu
Lipman Aaron Lipman Harvard University lipman@eccs.harvard.edu
Loft Richard Loft National Center for Atmospheric Research loft@ncar.ucar.edu
Love Carl Love Sequent Computer Systems carll@sequent.com
Lovett Tom Lovett Sequent tdl@sequent.com
Luo Yong Luo CIC-19, Los Alamos National Lab yongl@lanl.gov
Lyon Terry Lyon Hewlett Packard
Mackenzie Kenneth Mackenzie M.I.T. kenmac@lcs.mit.edh
Madan Viranjit Madan Motorola vmadan@firepower.com
Madraswala Taher Madraswala Intel Corp. tmadrasw@sedona.intel.com
Maeng Seungryoul Maeng KAIST maeng@camars.kaist.ac.kr
Maier Jay Maier ITT Technical Institute jmaier@qgraph.com
Maitland Roger Maitland Nortel (Northern Telecom) maitland@nortel.ca
Man Richard Man Hewlett Packard Co. mun@cup.hp.com
Marquez Andres Marquez University of Delaware marquez@eecis.udel.edu
Marr Debbie Marr Intel Corp. dmarr@ichips.intel.com
Martin Milo Martin UW-Madison milo@cs.wisc.edu
Martin Richard Martin University of California-Berkeley rmartin@cs.berkeley.edu
Mateo Valero Mateo UPC mares@ac.upc.es
Maxon Dawn Maxon Silicon Graphics dawn@asd.sgi.com
Maynard Ann Marie Maynard IBM amg@austin.ibm.com
McCombs Craig McCombs Symbios Logic craig.mccombs@symbios.com
McCormick James McCormick Hewlett Packard jem@fc.hp.com
McCracken David McCracken Silicon Graphics dem@sgi.com
McMillen Robert McMillen NCR bob.mcmillen@sandiegoca.ncr.com
Merrill Michael Merrill NSA mhmerri@zombie.ncsc.mil
Michael Maged Michael University of Rochester michael@cs.rochester.edu
Michaud Pierre Michaud IRISA/INRIA pmichaud@irisa.fr
Miller Ethan Miller Univ. of Maryland Baltimore County elm@acm.org
Mills Jack Mills Intel jmills@mipos2.intel.com
Mitra Tulika Mitra State University of New York at Stony Brook mitra@cs.sunysb.edu
Miyamori Takashi Miyamori Toshiba miyam0@leland.stanford.edu
Modi Harit Modi University of Wisconsin-Madison harit@cs.wisc.edu
Moir Mark Moir University of Pittsburgh moir@cs.pitt.edu
Moore Charles Moore IBM Corporation cmoore@austin.ibm.com
Moshovos Andreas Moshovos University of Wisconsin-Madison moshovos@cs.wisc.edu
Mowry Todd Mowry University of Toronto tcm@eecg.toronto.edu
Mukherjee Shubhendu Mukherjee University of Wisconsin-Madison shubu@cs.wisc.edu
Murakami Kazuaki Murakami Kyushu University murakami@c.csce.kyushu-u.ac.jp
Myers Jeffrey Myers Motorola
Nachman Lama Nachman Intel Corp lnachman@mipos2.intel.com
Nagle David Nagle Carnegie Mellon University basseau@ece.cmu.edu
Nair Ravi Nair IBM Research nair@watson.ibm.com
Najjar Walid Najjar Colorado State University najjar@cs.colostate.edu
Nanda Ashwini Nanda IBM ashwini@watson.ibm.com
Narad Chuck Narad Silicon Graphics narad@sgi.com
Nation Wayne Nation IBM nation@vnet.ibm.com
Nayfeh Basem Nayfeh Stanford University bnayfeh@ogun.stanford.edu
Nemirovsky Mario Nemirovsky National Semiconductors Corp./ UCSB mario@ece.ucsb.edu
Nettleton Nyles Nettleton Sun Microsystems nyles@cyberspace.eng.sun.com
Nowatzyk Andreas Nowatzyk DEC-WRL agn@acm.org
Ofelt David Ofelt Stanford University ofelt@getalife.stanford.edu
Ofelt David Ofelt Stanford
Okamura Atsushi Okamura NEC Corporation / University of Wisconsin atsus-o@cs.wisc.edu
Olivieri Mauro Olivieri DIBE - University of Genoa olly@dibe.unige.it
Olukotun Kunle Olukotun Stanford University kunle@ogun.stanford.edu
Osborne Randy Osborne Mitsubishi Electric Research Lab osborne@merl.com
Oskin Mark Oskin U.C. Davis mhoskin@ucdavis.edu
Otterness Noel Otterness Mylex Corporation noel@mylexboulder.com
Padubidri Sanjay Padubidri Intel Corporation spadubid@ichips.intel.com
Pai Vijay Pai Rice University vijaypai@ece.rice.edu
Palacharla Subbarao Palacharla University of Wisconsin - Madison subbarao@cs.wisc.edu
Panda Dhabaleswar Panda The Ohio State University panda@cis.ohio-state.edu
Papworth Dave Papworth Intel Corporation papworth@ichips.intel.com
Parkin Mike Parkin Sun Microsystems parkin@eng.sun.com
Parkin Mike Parkin Sun Microsystems parkin@eng.sun.com
Patt Yale Patt The University of Michigan patt@eecs.umich.edu
Patterson David Patterson University of California, Berkeley pattrsn@cs.berkeley.edu
Peir Jih-Kwon Peir University of Florida peir@cise.ufl.edu
Penkovski Vladimir Penkovski Intel Corporation vlski@ichips.intel.com
Penrose Denise Penrose Morgan Kaufmann Publishers dpenrose@mkp.com
Perissakis Stelios Perissakis University of California-Berkeley sper@cs.berkeley.edu
Pimentel Andy Pimentel University of Amsterdam andy@wins.uva.nl
Pinkston Timothy Mark Pinkston University of Southern California tpink@charity.usc.edu
Plakal Manoj Plakal University of Wisconsin-Madison plakal@cs.wisc.edu
Postiff Matt Postiff University of Michigan postiffm@umich.edu
Pressel Daniel Pressel U.S. Army dmpresse@arl.mil
Preston Mark Preston Symbios Logic mark.preston@symbios.com
Przybylski Steven Przybylski Verdande Group sp@verdande.com
Rajagopal Arjun Rajagopal Texas Instruments arjun@ti.com
Ramamoorthy Balaji Ramamoorthy Intel Corporation balajir@ichips.intel.com
Raman Renu Raman Sun Microelectronics renu.raman@Eng.Sun.COM
Ranganathan Partha Ranganathan Rice University parthas@rice.edu
Rauchwerger Lawrence Rauchwerger Texas A&M University rwerger@cs.tamu.edu
Reinhardt Steve Reinhardt The University of Michigan stever@eecs.umich.edu
Rhee Won Rhee Hewlett Packard won@cdc.hp.com
Rixner Scott Rixner MIT rixner@ai.mit.edu
Roberts James Roberts Advanced Micro Devices james.roberts@amd.com
Rokicki Tomas Rokicki Hewlett-Packard Laboratories rokicki@hpl.hp.com
Ronen Ronny Ronen Intel Israel ronen@iil.intel.com
Rosenblum Mendel Rosenblum Stanford University mendel@cs.stanford.edu
Rosenfield Michael Rosenfield IBM Research mgr@watson.ibm.com
Rotenberg Eric Rotenberg University of Wisconsin - Madison ericro@cs.wisc.edu
Safranek Robert Safranek Sequent rjs@sequent.com
Sarrazin David Sarrazin Digital Equipment Corporation sarrazin@rock.enat.dec.com
Sastry Subramanya Sastry University of Wisconsin, Madison sastry@cs.wisc.edu
Savlsbury Ashley Savlsbury Sun Microsystems ash@eng.sun.com
Saxena Rahul Saxena Intel Corporation rsaxena@mipos2.intel.com
Scales Dan Scales Digital Equipment Corporation scales@pa.dec.com
Schnarr Eric Schnarr University of Wisconsin-Madison schnarr@cs.wisc.edu
Schoinas Ioannis Schoinas Univ. of Wisconsin - Madison schoinas@cs.wisc.edu
Scott Michael Scott University of Rochester scott@cs.rochester.edu
Scott Steve Scott SGI - Cray Research sls@cray.com
Sekiguchi Tomoki Sekiguchi Systems Development Lab., Hitachi Ltd.
Sery Douglas Sery The MIT Press dsery@mit.edu
Seznec Andre Seznec IRISA/INRIA seznec@irisa.fr
Shahidzenden Shahrokh Shahidzenden Intel Corporation shahro@ichips.intel.com
Sheaffer Gad Sheaffer Intel Corporation gss@ichips.intel.com
Shen John Shen CMU shen@ece.cmu.edu
Shimizu Takeshi Shimizu Fujitsu Laboratories HHB03665@niftyserve.or.jp
Shin Hyun J. Shin Hyundai Electronics / Memory R&D hjshin@sr.hei.co.kr
Shore Doug Shore Ross Technology doug@ross.com
Simpson Kenneth Simpson Univ. of Delaware simpson@ece.udel.edu
Sinhardy Balaram Sinhardy IBM Corporation balaram@vnet.ibm.com
Sipos Ivan Sipos Digital Equipment Co. sipos@zko.dec.com
Sivaram Rajeev Sivaram The Ohio State University sivaram@cis.ohio-state.edu
Skadron Kevin Skadron Princeton University skadron@cs.princeton.edu
Skazinski Joseph Skazinski Mylex Corporation joseph@mylexboulder.com
Sladic Dan Sladic University of Toronto sladic@eecg.toronto.edu
Smith Alan Smith University of California Berkeley smith@cs.berkeley.edu
Smith Bob Smith Hewlett-Packard bbs@fc.hp.com
Smith James Smith University of Wisconsin-Madison jes@ece.wisc.edu
Smith Michael D. Smith Harvard University smith@eecs.harvard.edu
Snelling David Snelling Fujitsu European Centre for Information Tech. snelling@fecit.co.uk
So Kimming So Philips Semiconductors kimming.so@sv.sc.philips.com
Sodani Avinash Sodani University of Wisconsin-Madison sodani@cs.wisc.edu
Sohi Gurindar Sohi Univ. of Wisconsin sohi@cs.wisc.edu
Spillinger Ilan Spillinger MTM Scientific Center ilans@iil.intel.com
Spink Aaron Spink Digital Equipment Corp. spink@pa.dec.com
Sprangle Eric Sprangle Ross Technology sprangle@ross.com
Sreenivasan Krishnamachar Sreenivasan Hewlett Packard sreeni@hpperf2.cup.hp.com
Srinivasan Srikanth Srinivasan Duke University sri@cs.duke.edu
Stamm Rebecca Stamm Digital Semiconductor rebecca.stamm@h10.mts.dec.com
Steffan Greg Steffan University of Toronto steffan@mit.sgi.com
Stenstrom Per Stenstrom Chalmers University pers@ce.chalmers.se
Stets Robert Stets University of Rochester stets@cs.rochester.edu
Stunkel Craig Stunkel IBM T.J. Watson Research Center stunkel@watson.ibm.com
Su Ching-Long Su Rockwell Semiconductor Systems
Sugumar Rabin Sugumar SGI/Cray Research rabin@cray.com
Surya S Surya Texas Instruments ssurya@asic.sc.ti.com
Swanson Mark Swanson University of Utah swanson@cs.utah.edu
Tabak Daniel Tabak George Mason University dtabak@osf1.gmu.edu
Talcott Adam Talcott Sun Microsystems, Inc. adam.talcott@eng.sun.com
Tanksalvala Darius Tanksalvala Hewlett Packard dft@fc.hp.com
Tarui Toshiaki Tarui Hitachi, Central Research Lab. tarui@crl.hitachi.co.jp
Taura Hisatoshi Taura Justsystem Corporation taura@justsystem.co.jp
Taylor Michael Taylor M.I.T. mtaylor@lcs.mit.edu
Teodosiu Dan Teodosiu Stanford University dant@cs.stanford.edu
Terman Fred W. Terman Naval Postgraduate School terman@ece.nps.navy.mil
Thomas Randi Thomas University of California Berkeley randit@cs.berkeley.edu
Tirumalai Partha Tirumalai Sun Microelectronics ppt@eng.sun.com
Torrellas Josep Torrellas University of Illinois torrella@cs.uiuc.edu
Tran Thang Tran AMD thang.tran@amd.com
Tremblay Marc Tremblay Sun Microsystems tremblay@eng.sun.com
Tullsen Dean Tullsen UC San Diego tullsen@cs.ucsd.edu
Tyson Gary Tyson The University of Michigan tyson@eecs.umich.edu
Uhlig Richard Uhlig Intel Corporation ruhlig@ichips.intel.com
Unrau Ron Unrau University of Alberta unrau@cs.ualberta.ca
Vajapeyam Sriram Vajapeyam Indian Institute of Science sriram@cs.wisc.edu
Valentine Robert Valentine Intel bval@iil.intel.com
Valentine Robert Valentine Intel bval@iil.intel.com
Valero Mateo Valero Universitat Politecnica de Catalunya mateo@ac.upc.es
Veenstra Jack Veenstra Silicon Graphics veenstra@sgi.com
Veidenbaum Alex Veidenbaum U of Illinois - Chicago alexv@eecs.uic.edu
Vellanki Vivekanand Vellanki Georgia Institute of Technology vivek@cc.gatech.edu
Vengroff Darren Vengroff Univ. of Delaware vengroff@ece.udel.edu
Vijaykumar T.N. Vijaykumar University of Wisconsin-Madison vijay@cs.wisc.edu
Waldecker Brian Waldecker Somerset Design Center brianw@ibmoto.com
Wang Kanbao Wang Intel Corporation kbwang@mipos2.intel.com
Wang Wen-Hann Wang Intel wang@ichips.intel.com
Warnakulasuriya Sugath Warnakulasuriya University of Southern California sugath@charity.usc.edu
Weber Wolf-Dietrich Weber HAL Computer Systems lupus@hol.com
Weems Charles Weems University of Mass. weems@cs.umass.edu
Weiser Uri Weiser Intel weiser@ilccml.iil.intel.com
Wicki Thomas Wicki Sun Microsystems, Inc. wicki@eng.sun.com
Williams Eric Williams Silicon Graphics, Inc. williams@sgi.com
Williamson Jeremiah Williamson University of Wisconsin - Madison jeremiah@ece.wisc.edu
Wilson Kenneth M. Wilson Stanford University kwilson@shasta.stanford.edu
Wilson Pete Wilson Motorola wilson@ibmoto.com
Wong David Wong SGS-Thomson Microelectronics, Inc. dwong@metaflow.com
Wood David Wood University of Wisconsin - Madison david@cs.wisc.edu
Woods John Woods University of Manchester, U.K. jvwoods@cs.man.ac.uk
Worrell Kurt Worrell Ross Technology kworrell@ross.com
Yamauchi Tadaaki Yamauchi Mitsubishi Electric Corporation tadaaki1@leland.stanford.edu
Yang Chia-Lin Yang Duke University yangc@cs.duke.edu
Yang Woodward Yang Harvard University woody@eecs.harvard.edu
Yeh Tse-Yu Yeh Intel Corporation tyyeh@mipos2.intel.com
Yeung Donald Yeung M.I.T. piano@lcs.mit.edh
Young Cliff Young Harvard University cyoung@eecs.harvard.edu
Young Luke Young Tandem Computers, Inc. luke@austx.tandem.com
Yu James Yu University of Wisconsin jyu@cs.wisc.edu
Zhai Antonia Zhai Dept. of Electrical and Computer Engineering zhaia@eecg.toronto.edu
Ziegler Michael Ziegler Hewlett Packard ziegler@cup.hp.com
Zilles Craig Zilles U.W. Madison Electrical and Computer Eng. zilles@ece.wisc.edu
Zyuban Victor Zyuban University of Notre Dame vzyuban@cse.nd.edu